All-round three-dimensional solder paste status display of the entire board, which really intuitively reflects the printing defect status of the entire board solder paste

In 3D state, solder paste status display

Missing print, less tin

Double digital projection, no shadows, high accuracy, using plane fitting to perfectly handle substrate bending, adaptable to flexible substrates, effectively improving detection range through the combination of high and low frequency gratings, providing graphical quality trend distribution, and predicting defects in advance. And identify potential factors that contribute to the trend in advance, make timely adjustments, and control the spread of the trend.
All-round three-dimensional solder paste status display of the entire board, which really intuitively reflects the printing defect status of the entire board solder paste

In 3D state, solder paste status display

Missing print, less tin

Device type: online automatic 3D SPI
Special features: 3D high-precision contour measurement technology perfect application
Applicable substrate: 50mm x 70mm-510mm x 460mm
Substrate thickness: 0.6mm-6.0mm Resolution: 10μm-15μm (adjustable)
Height measurement accuracy: 1μm
Dimensions:W1080 x D1300 x H1850(mm)
Weight: 740KG
PRODUCT ENQUIRY
online automatic 3D SPI