Product Overview
The XDC-FB460 flipping machine is an automatic board entry and exit, 180 ° rotation, seamless integration of front and rear equipment (printing machine, surface mount machine, reflow soldering, AOI, testing machine), matched with SMEMA protocol, to achieve unmanned assembly line.
Technical parameters applicable for PCB size: W50mm xL50mm - W460mm xL400mm; PCB thickness: 0.5mm-4.0mm (or fixture); Track: Single track 180 degrees; Loading speed: 9 seconds per piece; Power supply voltage: 220V AC, 50/60Hz; Pressure: ≥ 0.5MPa Power: 450W; Environmental temperature and humidity requirements: 25 ± 3 ℃/40-70% RH; can be customized according to customer requirements.
Physical characteristics: Equipment size: 500mm (L) x 900mm (W) x 1264mm (H); Weight: 120kg; Safety: Protective cover protection; Transmission direction: left to right or right to left (optional) Material: sheet metal frame, aluminum alloy for moving parts; Color: White small orange pattern (computer white).
Function description: Automatic board loading and flipping support for multiple sizes of PCB boards; Adjustable rail width to adapt to different specifications of PCBs; Transmission height 900 ± 20mm; rotation uses an 86 step stepper motor for flipping; Transmission motor 57 stepper motor; The human-machine interface adopts a 4.3-inch display and control touch screen; The width adjustment adopts a ball screw; Support seamless integration with SMT production lines.
Warranty and support warranty period: 1 year; After sales service: Free technical support.
