Lead free hot air reflow soldering

Lead free hot air reflow soldering multi-layer insulation furnace design, reducing the surface temperature of the furnace shell by 10 to 20 degrees, effectively reducing the working environment temperature; The dual rail structure effectively improves production efficiency, saves energy consumption and production costs

Lead free hot air reflow soldering

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Features/FEATURES

95% of the materials on the machine can be recycled and reused; Strengthen the main crane arm to ensure lateral deformation of the guide rail and prevent the occurrence of jamming and falling off of the board

Multi layer insulation furnace design reduces the surface temperature of the furnace shell by 10 to 20 degrees, effectively lowering the working environment temperature;

The dual rail structure effectively improves production efficiency, saves energy consumption and production costs; With a 15% improvement in heat transfer efficiency, it can easily meet the lead-free process requirements of more complex and larger soldering products;

The new cooling structure design allows most of the exhaust gas to be filtered or recovered before returning to the furnace, reducing heat loss and making flux recovery more thorough;  

The furnace adopts a fully protected closed design to effectively prevent the loss of ammonia gas, resulting in a minimum nitrogen concentration of 150ppm;

Low ammonia consumption, only 20-22m2/H in an oxygen concentration environment of 300-800ppm.